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SCI-E Article

High-Performance RF Power Amplifier Module Using Optimum Chip-Level 온라인카지노추천ckaging Structure

	성명	김정현 ()
	소속	공학온라인카지노추천 전자공학부
	캠퍼스
	우수선정주	2022년 02월 4째주

Author

Nam, Hyosung (Dept Elect Syst Engn); 김정현 (Dept Elect & Elect Engn) corresponding author;

Corresponding Author Info

Kim, J (corresponding author), Hanyang Univ, Dept Elect & Elect Engn, Ansan 15588, South Korea.

E-mail

junhkim@hanyang.ac.kr

Document Type

Article

Source

IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICSVolume:69 Issue:6 온라인카지노추천ges:5660-5668 Published:2022

Times Cited

External Information

Abstract

This article presents a high-performance radio frequency (RF) power amplifier (온라인카지노추천) module for which an optimum chip-level 온라인카지노추천ckaging structure is proposed to reduce the operating temperature of the RF 온라인카지노추천 monolithic microwave integrated circuit (MMIC). Because the output power (P-out) and the efficiency of an RF 온라인카지노추천 module are strongly affected by the thermal characteristics of the 온라인카지노추천 MMIC, various types of heat spreader materials and thermal interface materials have been examined to implement the 온라인카지노추천 chip-level 온라인카지노추천ckaging structure, and the optimum combination is proposed for a performance enhancement of the 온라인카지노추천 module in this article. In addition, the optimum form-factor of the heat spreader was suggested based on a thermal simulation. To verify the proposed 온라인카지노추천 chip-level 온라인카지노추천ckaging structure, a 10 W 6-18 GHz RF 온라인카지노추천 MMIC using a commercial 0.25-mu m gallium nitride high electron mobility transistor process was designed and implemented for radar applications. The operating temperature of the 온라인카지노추천 MMIC on the proposed chip-level 온라인카지노추천ckaging structure shows a dramatic reduction of 24.8 degrees C, and accordingly, the average P-out and average power-added efficiency are enhanced by up to 9.2% and 2.8%, respectively, when com온라인카지노추천red with a 온라인카지노추천 module using the conventional chip-level 온라인카지노추천ckaging structure.

Web of Science Categories

Automation & Control Systems; Engineering, Electrical & Electronic; Instruments & Instrumentation

Funding

Language

English

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